?2010 Fairchild Semiconductor Corporation
 
www.fairchildsemi.com
FL6961 " Rev. 1.0.2
10
Physical Dimensions
8?/DIV>
0?/DIV>
SEE DETAIL A
NOTES: UNLESS OTHERWISE SPECIFIED
  A) THIS PACKAGE CONFORMS TO JEDEC
  MS-012, VARIATION AA, ISSUE C,
  B) ALL DIMENSIONS ARE IN MILLIMETERS.
  C) DIMENSIONS DO NOT INCLUDE MOLD
  FLASH OR BURRS.
  D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
  E) DRAWING FILENAME: M08AREV13
LAND PATTERN RECOMMENDATION
SEATING PLANE
0.10  C
C
GAGE PLANE
 x 45?/DIV>
DETAIL A
SCALE: 2:1
PIN ONE
INDICATOR
4
8
1
C
M
B A
0.25
B
5
A
5.60
0.65
1.75
1.27
6.20
5.80
3.81
4.00
3.80
5.00
4.80
(0.33)
1.27
0.51
0.33
0.25
0.10
1.75 MAX
0.25
0.19
0.36
0.50
0.25
R0.10
R0.10
0.90
0.406
(1.04)
OPTION A - BEVEL EDGE
OPTION B - NO BEVEL EDGE
 
 
Figure 15.    8-Lead, SOIC, JEDEC MS-012, .150 Inch Narrow Body
 
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchilds worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
 
Always visit Fairchild Semiconductors online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
.
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